Huawei to Release 3nm Chip in 2026

Huawei is working with Semiconductor Manufacturing International Corp (SMIC) on an advanced 3nm chip. The Chinese tech giant is preparing to send the design to China’s largest chipmaker in 2026.

The company, severely hit by the US sanctions, is shifting to a gate-all-around (GAA) architecture, which is used by Samsung Foundry, and moving away from traditional silicon designs. It is developing a so-called carbon-based 3nm design, featuring carbon nanotubes and two-dimensional materials. The company completed lab validation of the 3nm chip, which is currently undergoing production line adaptation at SMIC.

The joint R&D initiative clearly demonstrates that US trade sanctions have failed to halt China’s efforts to create a viable domestic chip sector capable of producing advanced products. Nvidia CEO Jensen Huang recently acknowledged the gap between US and Chinese chips is narrowing, and called attempts by the US to restrict the export of AI chips to China a failure.